Thermal Reflow Oven Profiler

The soldering industry use a specifically designed model of oven in their manufacturing process in order to solder under strictly controlled conditions. To maintain these conditions and as a quality assurance procedure soldering companies use a thermal reflow oven profiler.

The thermal reflow oven profiler produces a set of time-temperature data by measuring certain dimensions including peak, soak, slope and TAL (time above liquidus). This ensures that all products are manufactured under the same conditions and provides a report for future use if there is a problem with a batch.

Due to the special requirements of the soldering industry, two different types of specifically designed thermal reflow oven profiler can be used; Ram-Soak-Spike (RSS) or Ramp to Spike (RTS). The use of thermal reflow oven profilers is not the only way of conducting quality assurance but it produces some of the more vital data required to stay ahead in the market.