Reflow Temperature Profiling

The soldering industry use a specifically designed model of oven, called reflow ovens, in their manufacturing process in order to solder under strictly controlled conditions. To maintain these conditions and as a quality assurance procedure soldering companies use reflow temperature profiling systems.

Reflow temperature profiling systems produce a set of time-temperature data by measuring certain dimensions including peak, soak, slope and TAL (time above liquidus). This ensures that all products are manufactured under the same conditions and provides a report for future use if there is a problem with a batch.

Due to the special requirements of the soldering industry, two different types of specifically designed reflow temperature profiler can be used; Ram-Soak-Spike (RSS) or Ramp to Spike (RTS). The use of reflow oven profilers is not the only way of conducting quality assurance but it produces some of the more vital data required to stay ahead in the market.