• Computing

A CSP (Chip Scale Package) is a type of circuit carrier, an alternative to a ball grid array or a pin grid array. A chip scale package is the half the size of a pencil-top eraser and is not intended to be used for large circuit designs. Though the CSP is generally more reliable that its alternatives, a rework is sometimes necessary. Chip Scale Packages are used primarily in small electronic objects such as mobile phones.

It is often very difficult to rework CSPs in comparison to BGAs or PGAs due to the small size of the chip scale package. One process for CSP rework goes as follows:

• De-soldering
• Removal of solder residue
• Flux crème application
• Vacuum pen placement
• Re-soldering
• Infra-red heating

The total cost of a CSP rework is the same as a cost for a BGA rework.